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| ¤ýÆǸŰ¡ | 20,700 ¿ø (10%, 2,300 ¿ø ÇÒÀÎ) | | ¤ýÀû¸³±Ý | 1,150 ¿ø (5% Àû¸³) | | | | ¤ýÃâ°£ÀÏ : 2016 ³â 3 ¿ù 10 ÀÏ | | ¤ý340 ÂÊ | 190*260mm | ISBN : 9788931532616 | | | | ¤ý1¸¸¿ø ÀÌ»ó ÁÖ¹®½Ã ¹«·á¹è¼Û | |
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| ¢º ÀÌ Ã¥Àº ¹ÝµµÃ¼ ÆÐÅ°Áö¸¦ ´Ù·é À̷мÀÔ´Ï´Ù. ¹ÝµµÃ¼ ÆÐÅ°ÁöÀÇ ±âÃÊÀûÀÌ°í Àü¹ÝÀûÀÎ ³»¿ëÀ» ÇнÀÇÒ ¼ö ÀÖµµ·Ï ±¸¼ºÇß½À´Ï´Ù. |
CHAPTER 1 ¹ÝµµÃ¼ ÆÐÅ°Áö °³¿ä
1ÆÐÅ°Áö(Package)ÀÇ Á¤ÀÇ
2ÆÐÅ°ÁöÀÇ ¿ªÇÒ
3ÆÐÅ°Áö ±â¼ú Æ®·»µå
CHAPTER 2 ÆÐÅ°Áö Á¾·ù¿Í °øÁ¤
1ÆÐÅ°ÁöÀÇ Á¾·ù
2ÆÐÅ°ÁöÀÇ °øÁ¤
CHAPTER 3 ¼±Çà ÆÐÅ°Áö ±â¼ú
1Çø³ Ĩ(Flip Chip) ÆÐÅ°Áö
2RDL(Re-Distribution Layer)
3WLCSP(Wafer Level Chip Scale Package)
4TSV(Through Si Via) ÀûÃþ
CHAPTER 4 Àü±â ¹× ±¸Á¶ Çؼ®
1Àü±â Çؼ®
2±¸Á¶ Çؼ®
CHAPTER 5 ÆÐÅ°Áö ¼³°è
1¸®µå ÇÁ·¹ÀÓ ¼³°è °¡À̵å(Lead Frame Design Guide)
2¹ÝµµÃ¼ ±âÆÇ ¼³°è °¡À̵å(Substrate Design Guide)
CHAPTER 6 ÆÐÅ°Áö Àç·á
1¸®µå ÇÁ·¹ÀÓ(Lead Frame)
2񃒀(Substrate)
3Å×ÀÌÇÁ(Tape)
4Á¢ÂøÁ¦(Adhesive)
5±Ý¼Ó(Metal)
6±âŸ
CHAPTER 7 ÆÐÅ°Áö ½Å·Ú¼º
1ÆÐÅ°Áö ½Å·Ú¼º(Reliability)ÀÇ °³¿ä
2BGA, CSP ½Å·Ú¼º
CHAPTER 8 ÃøÁ¤
1¿þÀÌÆÛ µÎ²² ÃøÁ¤
2Àü±â ´ÜÀÚ Å©·¹ÀÌÅ͸µ °Ë»ç(PAD Cratering Inspection)
3º¼ ÀÎÀå/Àü´Ü ½ÃÇè(Wire Ball Pull/Shear Test)
4¼Ö´õ º¼ ÀÎÀå/Àü´Ü ½ÃÇè(Solder Ball Pull/Shear Test)
5Á¢ÃË°¢(Contact Angle) ÃøÁ¤
6ÇÁ·ÎÆÄÀÏ ÇÁ·ÎÁ§Æ®(Profile Project)
7¿¢½º·¹ÀÌ(X-Ray) °Ë»ç
8ÃÊÀ½ÆÄ ºñÆı« °Ë»ç±â
9XRF(X-Ray Fluorescence) Spectroscopy
10Warpage ÃøÁ¤±â
CHAPTER 9 Ĩ ±úÁü(Chip Crack) ÇØ°á »ç·Ê
1Ĩ ±úÁü(Chip Crack) ¼³¸í
2Ĩ ±úÁü(Chip Crack) ¹ß»ý »ç·Ê |
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